Model 3300 Wafer/Backlap Applicator

Model 3300 overall view A KO WEB
3300 open ko web

OVERVIEW

Semiconductor Equipment Corporation´s Model 3300 applies Protective Tape to Your Wafer Prior to Backlapping. The applicator also:

  • Eliminates bubbles between tape and wafer
  • Provides uniform tension between tape and wafer
  • Operates with backed and non-backed tape
  • Provides adjustable roller pressure
  • Cuts tape within .005 ” of edge of wafer

FEATURES

  • Up to 12 inch wafer capability standard.
  • Trims tape to the edge of the wafer including the flats, within .005 “.
  • Manual tape feed.
  • Manual tape tensioner.
  • Compatible with standard or interleaved tape.
  • Vacuum stage wafer hold-down.
  • Built in cutter tape separation systems.
  • Captive roller assembly assures consistent wafer/film frame contact pressure.
  • Adjustable spring loaded platen for optimum contact pressure.

OPTIONS

  • Static Eliminator with power supply.
  • Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
  • Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
  • DeTaper Option: for removing backgrinding tape once the wafer has been thinned. Includes: a) Roller assembly carrier. b) Vacuum chuck c) Tape dispenser

SPECIFICATIONS

  • Weight: TBD
  • Height: TBD
  • Width: TBD
  • Length: TBD
  • Vacuum: 25″ H20

OTHER INFO

SPARE PARTS

  • Spare Blades, End Cut
  • Spare Blades, Rotary, Wafer Trimme