Gearing Up For Flip Chip
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999
Flip Chip On Flex Interconnect Guidelines
by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999
Flip Chip Attachment
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
Diode Bonding Evolves To Meet Telecom Demand
by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999
Die Bonding In An Optoelectric World
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001
BGA Rework Technology
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
Automation In Die Bonding: When Less Is Better
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000
Thermosonic Bonding Gold Bumped Die
EQUIPMENT: MODEL 410 FLIP CHIP ALIGNER/BONDER; MODEL 410XP PRECISION BONDER; MODEL 860 OMNI BONDER
Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder.
Bonding Edge Emitting Laser Diodes
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding edge emitting laser diodes using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
Wafer Mounting For Dicing
EQUIPMENT: MODEL 300, 3100 AND 3150 WAFER FILM FRAME TAPE APPLICATORS
Application: Wafer mounting for dicing
Equipment: Models 300, 3100 & 3150 Wafer Film Frame Tape Applicators
Bonding Vcsel’s
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding vertical-cavity surface-emitting lasers (VCSELS) using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
Solder Flip Chip
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM
Application: Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System
Picking Die From Tape
EQUIPMENT: MODEL 4750 DIE EJECTOR SYSTEM; MODEL 4800 DIE EJECTOR GRID SYSTEM; MODEL 830 PICK & PLACE SYSTEM
Application: Picking die from dicing tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick and Place System
Rework of Underfilled Flip Chips
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM WITH MODEL 870 REWORK OPTION
Application: Rework of underfilled flip chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option
Inexpensive In-Process Planarity Adjustment For Die Attach
EQUIPMENT: MODEL 860 EAGLE BONDER
Application: Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder
Sticky Issues With Semiconductor Processing Tape
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996
Reworking Underfilled Flip Chips
by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000
Versatile Bonder Is The Design Key To Attaching Laser Diodes
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
US Tech, July 2001
Bonder Design Meets Telecom Challenges
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Laser Focus World, May 2001