Latest Articles
-
Exploring the Potential Future of Electric Vehicles
In recent years, electric vehicles (EVs) have emerged as a promising alternative to traditional internal combustion engine vehicles. With advancements in…
-
Gearing Up For Flip Chip
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999 -
Flip Chip On Flex Interconnect Guidelines
by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999 -
Flip Chip Attachment
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A -
Diode Bonding Evolves To Meet Telecom Demand
by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999 -
Die Bonding In An Optoelectric World
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001 -
BGA Rework Technology
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A -
Automation In Die Bonding: When Less Is Better
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000 -
Thermosonic Bonding Gold Bumped Die
EQUIPMENT: MODEL 410 FLIP CHIP ALIGNER/BONDER; MODEL 410XP PRECISION BONDER; MODEL 860 OMNI BONDER
Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder. -
Bonding Edge Emitting Laser Diodes
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding edge emitting laser diodes using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder -
Wafer Mounting For Dicing
EQUIPMENT: MODEL 300, 3100 AND 3150 WAFER FILM FRAME TAPE APPLICATORS
Application: Wafer mounting for dicing
Equipment: Models 300, 3100 & 3150 Wafer Film Frame Tape Applicators -
Bonding Vcsel’s
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding vertical-cavity surface-emitting lasers (VCSELS) using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder -
Solder Flip Chip
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM
Application: Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System -
Picking Die From Tape
EQUIPMENT: MODEL 4750 DIE EJECTOR SYSTEM; MODEL 4800 DIE EJECTOR GRID SYSTEM; MODEL 830 PICK & PLACE SYSTEM
Application: Picking die from dicing tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick and Place System -
Rework of Underfilled Flip Chips
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM WITH MODEL 870 REWORK OPTION
Application: Rework of underfilled flip chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option -
Inexpensive In-Process Planarity Adjustment For Die Attach
EQUIPMENT: MODEL 860 EAGLE BONDER
Application: Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder -
Sticky Issues With Semiconductor Processing Tape
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996 -
Reworking Underfilled Flip Chips
by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000 -
Versatile Bonder Is The Design Key To Attaching Laser Diodes
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
US Tech, July 2001 -
Bonder Design Meets Telecom Challenges
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Laser Focus World, May 2001