Why the Model 865 Die Bonder is Superior to other Comparable Bonders in the Market
The Model 865 Die Bonder has distinct advantages above other die bonders in its price category and the specific niche it was designed to…
Semiconductor Equipment Corporation is a small innovative company that has designed and manufactured back end manual equipment for the semiconductor and related industries for more than 46 years. In that time we have expanded our business to distribute products for Nitto Denko and Hugle Electronics. We service everything we sell.
Our products serve a variety of market segments related to semiconductor manufacturing and electronics packaging. The products designed and manufactured by us are manual and semiautomatic systems. We also distribute products for two Market leading Japanese companies.
Nitto Denko manufactures dicing and grinding tape including revolutionary “Revalpa” heat release tape. They also have semi-automatic and fully automatic wafer mounters and de-mounters,
Hugle International manufactures cleaning equipment for FOUPs, RSPs, and wafer cassettes as well as dry cleaning equipment for displays.
Check out what’s happening at SEC. Here you will find news about new product introductions, upgrades to existing products, trade show schedules, and other events that seem newsworthy.
The Model 865 Die Bonder has distinct advantages above other die bonders in its price category and the specific niche it was designed to…
We are fortunate that as an essential business, we have remained open and operating at full capacity since initial business closures in March. We continue…
Changes are coming! We are actively expanding our online store to include the most commonly requested spare parts for our mounters, bonders and rework equipment.…
Introducing the Model 365 UV Curing System for Dicing and Back Grinding Tape SEC will display the new Model 365 UV Curing system this year…
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