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About our Company
Semicondutor Equipment Corp.
Semiconductor Equipment Corporation is a small innovative company that has designed and manufactured back end manual equipment for the semiconductor and related industries for more than 46 years. In that time we have expanded our business to distribute products for Nitto Denko and Hugle Electronics. We service everything we sell.
Contact Us
805-529-2293
Our Products
Semiconductor Equipment Corporation’s products serve a broad range of market segments within semiconductor manufacturing and electronics packaging. Our core offerings include manual and semi-automatic systems designed and manufactured to meet the precision, reliability, and flexibility requirements of advanced assembly and backend operations.
In addition to SEC-designed equipment, we are an authorized distributor for two market-leading Japanese manufacturers, allowing us to provide a comprehensive portfolio of complementary process solutions.
Nitto Denko
Nitto Denko manufactures industry-leading dicing and back-grinding tapes, including the innovative REVALPHA® heat-release tape. Their product lineup also includes semi-automatic and fully automatic wafer mounters and de-mounters, widely used in advanced wafer handling and singulation processes.
Hugle International
Hugle International designs and manufactures cleaning systems for FOUPs, RSPs, and wafer cassettes, as well as dry-cleaning equipment for display and precision substrate applications, supporting contamination control in high-reliability manufacturing environments.
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