Gearing Up For Flip Chip
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999
Flip Chip On Flex Interconnect Guidelines
by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999
Flip Chip Attachment
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
Diode Bonding Evolves To Meet Telecom Demand
by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999
Die Bonding In An Optoelectric World
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001
BGA Rework Technology
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
Automation In Die Bonding: When Less Is Better
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000
Sticky Issues With Semiconductor Processing Tape
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996
Reworking Underfilled Flip Chips
by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000
Versatile Bonder Is The Design Key To Attaching Laser Diodes
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
US Tech, July 2001
Bonder Design Meets Telecom Challenges
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Laser Focus World, May 2001