Standard Dicing Tape & Ink Jet Cover Tape

OVERVIEWFor over 40 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with…

UV Curable Dicing Tape

OVERVIEWVery high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.SPECIFICATIONS P/N 24216 UE-2091J Extra High Tack, non-expandable Polyethylene, 90 um thick P/N 24339 DU-300 Super High Tack, expandable Polyolefin, 85 um thick – most popular UV Tape P/N 24351 NBD-5170K Super High Tack, expandable Polyolefin, 170 um thick – great for…

Heat Release Tape

OVERVIEW Revalpha thermal release materials are a unique and benefits-packed approach to your holding, transfer, carrier masking and protection applications.  It adheres like any normal adhesive material… but, when heat is applied, its adhesion disappears!   The substrate can easily be peeled off. There are two types of Revalpha:  Single-sided, which has a single layer of…

High Purity Tape

OVERVIEWHigh Purity Pressure Sensitive Expandable Tape with Liner. Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.BENEFITSThere is a Semiconductor Equipment Tape that is Perfect for Your Application. Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is…