https://www.semicorp.com/wp-content/uploads/2020/02/Model-3100-3150.mp4 OVERVIEWSemiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6″ in diameter,…
https://www.semicorp.com/wp-content/uploads/2020/02/Model-3100-3150.mp4 OVERVIEWSemiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6″ in…
OVERVIEWSemiconductor Equipment Corporation’s wafer/film tape applicator provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The Model 300 is specifically designed for 300mm wafers.FEATURES Up to 12” wafer capability standard. Accepts…
https://www.semicorp.com/wp-content/uploads/2020/02/Model-3250.mp4 https://www.semicorp.com/wp-content/uploads/2020/02/3250_Peeler.mp4 OVERVIEWSemiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also: Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Provides adjustable roller pressure Cuts…
https://www.semicorp.com/wp-content/uploads/2020/02/Model-3250.mp4 https://www.semicorp.com/wp-content/uploads/2020/02/3250_Peeler.mp4 OVERVIEWSemiconductor Equipment Corporation´s Model 3250 applies Protective Tape to Your Wafer Prior to Backlapping. The applicator also: Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Provides adjustable roller pressure Cuts…
