Model 3100 Wafer/Film Frame Tape Applicator

https://www.semicorp.com/wp-content/uploads/2020/02/Model-3100-3150.mp4   OVERVIEWSemiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6″ in diameter,…

Model 3150 Wafer/Film Frame Tape Applicator

https://www.semicorp.com/wp-content/uploads/2020/02/Model-3100-3150.mp4     OVERVIEWSemiconductor Equipment Corporation’s Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6″ in…

Model 300 Wafer/Film Frame Tape Applicator

OVERVIEWSemiconductor Equipment Corporation’s wafer/film tape applicator provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The Model 300 is specifically designed for 300mm wafers.FEATURES Up to 12” wafer capability standard. Accepts…

Model 3200 Wafer/Backlap Applicator

https://www.semicorp.com/wp-content/uploads/2020/02/Model-3250.mp4 https://www.semicorp.com/wp-content/uploads/2020/02/3250_Peeler.mp4 OVERVIEWSemiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also: Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Provides adjustable roller pressure Cuts tape within .005 ” of edge of wafer FEATURES Up…

Model 3250 Wafer/Backlap Applicator

https://www.semicorp.com/wp-content/uploads/2020/02/Model-3250.mp4   https://www.semicorp.com/wp-content/uploads/2020/02/3250_Peeler.mp4   OVERVIEWSemiconductor Equipment Corporation´s Model 3250 applies Protective Tape to Your Wafer Prior to Backlapping. The applicator also: Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Provides adjustable roller pressure Cuts tape within .005 ” of edge of wafer FEATURES Four,…