Model 865 Flip Chip Bonder

OVERVIEWThe Model 865 Flip Chip die bonder is ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression and epoxy die bonding. Some of the process capabilities that support these applications are ultrasonic scrub, linear mechanical scrub, compression bonding, flux dipping and hot gas…

Model 850 Flip Chip Placement System

https://www.semicorp.com/wp-content/uploads/2020/02/Model_850.mp4       OVERVIEW Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up…