Model 850 Flip Chip Placement System

https://www.semicorp.com/wp-content/uploads/2020/02/Model_850.mp4         OVERVIEW Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked…