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UA8400 Auto UV Irradiator / 200mm wafers

UA8400 Auto UV Irradiator / 200mm wafers


The UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.


8"/6" frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function Log file function standard equipment Follow to CE mark / SEMI S2/S8

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