The MA2008IIR / MA2008IIP is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.
Combination of various applications are available:
Non-contact arm, Non-contact table
Protection tape peeling / UV irradiation
MA2008IIR: for Roll tape
MA2008IIP: for Pre-cut tape
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Adding Wafer mapping scanner available
Adding SECS/GEM available
Follow to CE mark / SEMI S2/S8"