OVERVIEW
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.
SPECIFICATIONS
- P/N 24216 UE-2091J Extra High Tack, non-expandable Polyethylene, 90 um thick
- P/N 24339 DU-300 Super High Tack, expandable Polyolefin, 85 um thick – most popular UV Tape
- P/N 24351 NBD-5170K Super High Tack, expandable Polyolefin, 170 um thick – great for dicing BGA & ceramic
- P/N 25551 DU-2187G Expandable, 88 um thick – for metalized wafer
- P/N 25587 NBD-3190K Non-expandable, 193 um thick – for glass dicing
- P/N 25862 WS-02T Medium Tack expandable 88 um thick – general purpose
- P/N 26115 DU-2285KS Low Tack, expandable anti-ESD 85 um thick – for metallized wafer
- P/N 26120 DU-2385KS Low Tack, expandable anti-ESD 85 um thick – for metalized wafer with small die
- P/N 26133 DU-315KS Super High Tack, expandable Polyolefin, 85 um thick – anti-ESD
