OVERVIEW
The UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.
FEATURES
8″/6″ frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function Log file function standard equipment Follow to CE mark / SEMI S2/S8
