OVERVIEW
The Model 865 is a high precision semiautomatic flip chip die bonder which is ideal for use at universities, for research and development and for low volume production.
KEY BENEFITS
- High precision
- Servo driven closed loop system with load protection
- Bond loads from 10g to 10Kg
- Quick setup
- Easy to use
- Versatile
- R & D oriented, but also ideal for low volume production
- Semiautomatic
- Windows operating system with process parameters saved to macros
PROCESS CAPABILITIES
- Eutectic
- Thermocompression
- Reflow
- Hot gas spot heating
- Ultrasonic scrub
- Dipping, epoxy and flux
- Au, Au/Sn, In, Cu and more
APPLICATIONS
- Flip chip, solder and gold bumped
- Die attach
- Optoelectronics and optical components
- Edge emitting laser diodes
- MEMS, MOEMS, MCM
- Micro-assembly
FEATURES AND OPTIONS
- Easily interchangeable head designs for the applications listed above
- Single Tool Head, up to 10Kg, 350C
- Dual Tool Head allows perform or dipping and die placement in one cycle
- Ultrasonic Head with loads up to 10Kg
- Pulsed Thermal Bond Head with fast ramping of up to 100C
- Various work stage designs (custom work stages available)
- Rapid Heat Stage, 50 x 50mm with cover gas and ramping temperatures to 450C
- 2 x 2 and 4 x 4 steady state heated stages to 350C
- 4 x 4 unheated stage
- High precision Vision Systems
- Dual camera system for highest precision applications
- Cube Beam Splitter system for general applications
- Motorized viewer movement with programmable positions
- Camera and lighting parameters saved to macros
SPECIFICATIONS
- Click on brochure to see specifications
