Adjustable spring loaded platen for optimum contact pressure.
Static Eliminator with power supply.
Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
DeTaper Option: for removing backgrinding tape once the wafer has been thinned. Includes: a) Roller assembly carrier. b) Vacuum chuck c) Tape dispenser