Adjustable spring loaded platen for optimum contact pressure.
Static Eliminator with power supply.
Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
DeTaper Option: for removing backgrinding tape once the wafer has been thinned. Includes: a) Roller assembly carrier. b) Vacuum chuck c) Tape dispenser
Weight: 25 lbs.
Vacuum: 25″ H20
Spare Blades, End Cut
Spare Blades, Rotary, Wafer Trimme
STEP BY STEP PROCEDURE
Quickly, Easily and Uniformly Mounts Protective Tape to Wafer for Back Lap Operation
Grasp tape from storage position. Pull over wafer mounting platen.
Affix tape to tensioner frame.
Roll tape with preset tension across wafer for bubble-free application.
Close cutter cover.
Separate tape from roll, using built-in slitter.
Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame.