OVERVIEW
Semiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also:
- Eliminates bubbles between tape and wafer
- Provides uniform tension between tape and wafer
- Operates with backed and non-backed tape
- Provides adjustable roller pressure
- Cuts tape within .005 ” of edge of wafer
FEATURES
- Up to 6″ wafer capability standard.
- Trims tape to the edge of the wafer including the flats, within .005″.
- Manual tape feed.
- Manual tape tensioner.
- Compatible with standard or interleaved tape.
- Vacuum stage wafer hold-down.
- Built in cutter tape separation systems.
- Captive roller assembly assures consistent wafer/film frame contact pressure.
- Adjustable spring loaded platen for optimum contact pressure.
- Manual.
OPTIONS
- Static Eliminator with power supply.
- Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
- Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
- DeTaper Option: for removing backgrinding tape once the wafer has been thinned. Includes: a) Roller assembly carrier. b) Vacuum chuck c) Tape dispenser
SPECIFICATIONS
- Weight: 25 lbs.
- Height: 8″
- Width: 14″
- Length: 24″
- Vacuum: 25″ H20
OTHER INFO
SPARE PARTS
- Spare Blades, End Cut
- Spare Blades, Rotary, Wafer Trimme
STEP BY STEP PROCEDURE
Quickly, Easily and Uniformly Mounts Protective Tape to Wafer for Back Lap Operation
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Step #1 Grasp tape from storage position. Pull over wafer mounting platen. |
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Step #2 Affix tape to tensioner frame. |
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Step #3 Roll tape with preset tension across wafer for bubble-free application. |
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Step #4 Close cutter cover. |
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Step #5 Separate tape from roll, using built-in slitter. |
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Step #6 Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame. |
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Step #7 Remove finished wafer assembly. |
