OVERVIEW
The MA2008IIR / MA2008IIP is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.
FEATURES
Combination of various applications are available: DSC, Coin-stack Non-contact arm, Non-contact table Protection tape peeling / UV irradiation Panel mounting MA2008IIR: for Roll tape MA2008IIP: for Pre-cut tape Easy operation by Touch panel & Recipe function Log file function standard equipment Adding Wafer mapping scanner available Adding SECS/GEM available Follow to CE mark / SEMI S2/S8″
