OVERVIEW
Cleaning FOUPs and FOSBs is required to improve and maintain the yield of the semiconductor manufacturing process. The IF-12 can wash and dry a variety of FOUPs and FOSBs in one system without changing the set-up because of our unique chamber structure.
FEATURES
- High through-put (compared with our previous system)
- Small foot print design
- Protection from electrostatic charge
- Super purity washing by nozzle jet
- Hot air knife drying method will shorten drying time efficiently
- Automatic FOUP Opener function (option)
- Complete Drying by reliable and successful “hot air spraying” and “high speed spin”
- Dust suppression, ESD elimination system equipping with fine filter and Ionizer
- Securing working space for disassemble & assemble container (no need to arrange clean booth separately)
- Automatic purging function to prevent growth of bacteria
- Auto flushing fuction prevents dead water
- Easy operation by touch panel
- Ensure High safety with completion of various interlocking system
SPECIFICATIONS
- Dimension: 2300(W)x1400(D)x2200(H)mm （Excluding any projections）
- Weight: 800kg
- Power: 3 phase AC200+-10V
- Exhaust: 3000 litter/min
- Drain: 10 litter/min
- D.I .Water:
- Supply (10 litter/min as minimum)
- Pressure (0.3Mpa)
- CDA (Clean Dry Air)
- Supply (2500 litter/min)
- Pressure (0.75Mpa)
- Automatic FOUP opener and filter for DI water are available as optional item
