OVERVIEW
Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.
BENEFITS
Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.
Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape.
Please contact our Tape Specialist for additional information at (805) 529-2293.
SPECIFICATIONS
- P/N 24202 V8LR Low Tack, 75 um thick
- P/N 24205 V8TR Low Tack, 75 um thick
- P/N 24211 VD15R High Tack, 145 um thick
- P/N 25213 V8SR Medium Tack; Wide variety of uses, no change in adhesion over time, 70 um thick
