Thermosonic Bonding Gold Bumped Die
EQUIPMENT: MODEL 410 FLIP CHIP ALIGNER/BONDER; MODEL 410XP PRECISION BONDER; MODEL 860 OMNI BONDER
Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder.