EQUIPMENT: MODEL 410 FLIP CHIP ALIGNER/BONDER; MODEL 410XP PRECISION BONDER; MODEL 860 OMNI BONDER
Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder.
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding edge emitting laser diodes using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
EQUIPMENT: MODEL 300, 3100 AND 3150 WAFER FILM FRAME TAPE APPLICATORS
Application: Wafer mounting for dicing
Equipment: Models 300, 3100 & 3150 Wafer Film Frame Tape Applicators
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding vertical-cavity surface-emitting lasers (VCSELS) using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM
Application: Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System
EQUIPMENT: MODEL 4750 DIE EJECTOR SYSTEM; MODEL 4800 DIE EJECTOR GRID SYSTEM; MODEL 830 PICK & PLACE SYSTEM
Application: Picking die from dicing tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick and Place System
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM WITH MODEL 870 REWORK OPTION
Application: Rework of underfilled flip chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option
EQUIPMENT: MODEL 860 EAGLE BONDER
Application: Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder
this is just a test