Gearing Up For Flip Chip
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999
by George Riley, HyComp Inc.
Marlborough, MA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Solid State Technology, 1999
by Tim Patterson, Smartflex Systems, Iinc.
Tustin, CA
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuit Assembly, November 1999
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
by Edward Stephens, Industrial Microphotonics Co.
St. Charles, MO
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Optoelectronics World, 1999
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Circuits Assembly, 2001
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
N/A
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Meptec Report, January/February 2000
EQUIPMENT: MODEL 410 FLIP CHIP ALIGNER/BONDER; MODEL 410XP PRECISION BONDER; MODEL 860 OMNI BONDER
Application: Thermosonic bonding gold bumped die.
Equipment: Model 410 Flip Chip Aligner/Bonder, Model 410XP Precision Bonder, Model 860 Omni Bonder.
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding edge emitting laser diodes using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
EQUIPMENT: MODEL 300, 3100 AND 3150 WAFER FILM FRAME TAPE APPLICATORS
Application: Wafer mounting for dicing
Equipment: Models 300, 3100 & 3150 Wafer Film Frame Tape Applicators
this is just a test