SEC will do live demonstrations of Wafer Mounting, UV Tape, UV cure, and Die Picking in our booth 5958 at Semicon West 2017.
SEC will have a Model 3150 Wafer/Frame Tape Applicator loaded with Nitto DU300 UV Dicing Tape. We will mount a 200 mm wafer on a frame. We will not have dicing capability so we will cure the full wafer undiced on the New Model 365 UV Exposure System. Next we will remove the wafer from the tape on a Model 4800 Die Ejector Grid demonstrating the removal of die from tape without a pin poker.
