OVERVIEWVery high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.SPECIFICATIONS P/N 24216 UE-2091J Extra High Tack, non-expandable Polyethylene, 90 um thick P/N 24339 DU-300 Super High Tack, expandable Polyolefin, 85 um thick – most popular UV Tape P/N 24351 NBD-5170K Super High Tack, expandable Polyolefin, 170 um thick – great for…
OVERVIEW Revalpha thermal release materials are a unique and benefits-packed approach to your holding, transfer, carrier masking and protection applications. It adheres like any normal adhesive material… but, when heat is applied, its adhesion disappears! The substrate can easily be peeled off. There are two types of Revalpha: Single-sided, which has a single layer of…
OVERVIEWHigh Purity Pressure Sensitive Expandable Tape with Liner. Low ionic impurities and adhesion stability make this the perfect tape for your clean room application.BENEFITSThere is a Semiconductor Equipment Tape that is Perfect for Your Application. Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is…
OVERVIEWSpecifically used to apply tape to seal the ink cartridge against ink leakage during storage and transportation.BENEFITSThere is a Semiconductor Equipment Tape that is Perfect for Your Application. Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation.…
OVERVIEWToday there is more pressure to develop process without the use of chemicals. We can help you with our unique line of water soluble adhesives. Whether you are bonding quartz, fused silica, Bk7, garnet, sapphire, ceramics or other single crystal hard materials, we have the right temporary adhesive at the right bonding temperature for your…
SEC will do live demonstrations of Wafer Mounting, UV Tape, UV cure, and Die Picking in our booth 5958 at Semicon West 2017. SEC will have a Model 3150 Wafer/Frame Tape Applicator loaded with Nitto DU300 UV Dicing Tape. We will mount a 200 mm wafer on a frame. We will not have dicing capability so we…
Introducing the Model 365 UV Curing System for Dicing and Back Grinding Tape SEC will display the new Model 365 UV Curing system this year at Semicon West 2017 in San Francisco. The Model 365 features the same long light source life and simple operation as our popular Model 360. New features include much higher…
BY SUZY TRITENBACH – SEC’S DICING TAPE SPECIALIST Deep Space Systems in Littleton, Colorado is a subcontractor on the Orion multipurpose crew vehicle. Lockheed Martin is the prime contractor for NASA on the Orion Project. What’s interesting about the Orion project is it will support travel to the International Space Station, the Moon, and Mars.…
BY SUZY TRITENBACH – SEC’S DICING TAPE SPECIALIST Google recently exited the self driving vehicle business and spun off a new company to continue the effort. Waymo opened for business in December of ’16 with a new approach. Google’s goal was to build a vehicle, sensor system, and software. Waymo has decided to focus on…
Semiconductor Equipment Corporation’s SORA UPC-12500 Fully Automatic FOUP Cleaning System has the highest throughput among single FOUP processing systems.