https://www.semicorp.com/wp-content/uploads/2020/02/Nitto-Msa-840-auto-wafer-mounter.mp4 OVERVIEWSemiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the…
OVERVIEWThe MA2008IIR / MA2008IIP is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.FEATURESCombination of various applications are available: DSC, Coin-stack Non-contact arm, Non-contact table Protection tape peeling / UV irradiation Panel mounting MA2008IIR: for Roll tape MA2008IIP: for Pre-cut tape Easy…
OVERVIEWThe DR8500-III applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″ wafer available 4″ wafer handling function (Option) Low tension applying (RF version) Adding Table/ Roller heating function available Easy operation by Touch panel Follow to CE mark Adding SECS/GEM available
OVERVIEWThe HR8500-III removes protection tape from the wafer patterned surface after back-grinding.FEATURES8″/6″/5″”wafer available – 4″ wafer handling (Option) Table heating function Thin wafer available (TW version) Easy operation by Touch panel Adding SECS/GEM available
OVERVIEWThe DSA 840-ll applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8
OVERVIEWThe HSA 840-ll removes protection tape from the wafer patterned surface after the back-grinding process.FEATURES8″/6″”/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8″
OVERVIEWThe UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.FEATURES8″/6″ frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function…
OVERVIEWThe Model 865 is a high precision semiautomatic flip chip die bonder which is ideal for use at universities, for research and development and for low volume production.KEY BENEFITS High precision Servo driven closed loop system with load protection Bond loads from 10g to 10Kg Quick setup Easy to use Versatile R & D oriented,…
https://www.semicorp.com/wp-content/uploads/2020/02/Model_850.mp4 OVERVIEW Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up…
OVERVIEWHot Gas Rework Station Removes Surface Mounted Components And Bonded Die. Using carefully regulated heat controls, quickly and easily removes surface mounted components and bonded die from PC boards, hybrid micro-circuits and packages without disturbing nearby components or damaging the removed device.DESCRIPTIONBonded die or surface mounted components can be removed with this versatile rework station. Rework…