HR8500-III Full-Auto Tape Remover / 200MM Wafers
OVERVIEWThe HR8500-III removes protection tape from the wafer patterned surface after back-grinding.FEATURES8″/6″/5″”wafer available – 4″ wafer handling (Option) Table heating function Thin wafer available (TW version) Easy operation by Touch panel Adding SECS/GEM available