OVERVIEWThe HR8500-III removes protection tape from the wafer patterned surface after back-grinding.FEATURES8″/6″/5″”wafer available – 4″ wafer handling (Option) Table heating function Thin wafer available (TW version) Easy operation by Touch panel Adding SECS/GEM available
OVERVIEWThe DSA 840-ll applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8
OVERVIEWThe HSA 840-ll removes protection tape from the wafer patterned surface after the back-grinding process.FEATURES8″/6″”/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8″
OVERVIEWThe UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.FEATURES8″/6″ frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function…
OVERVIEWThe Model 865 is a high precision semiautomatic flip chip die bonder which is ideal for use at universities, for research and development and for low volume production.KEY BENEFITS High precision Servo driven closed loop system with load protection Bond loads from 10g to 10Kg Quick setup Easy to use Versatile R & D oriented,…
https://www.semicorp.com/wp-content/uploads/2020/02/Model_850.mp4 OVERVIEW Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up…
OVERVIEWHot Gas Rework Station Removes Surface Mounted Components And Bonded Die. Using carefully regulated heat controls, quickly and easily removes surface mounted components and bonded die from PC boards, hybrid micro-circuits and packages without disturbing nearby components or damaging the removed device.DESCRIPTIONBonded die or surface mounted components can be removed with this versatile rework station. Rework…
OVERVIEW Revolutionary new design cures UV tapes quickly and uniformly, features a long life light source and handles all size wafers up to 300 mm. The Model 365 UV exposure system needs no external ventilation and has a small footprint. FEATURES Cures most UV tape in 5 seconds Programmable N2 purge and cure time Touch screen control…
OVERVIEWThe Model 4750 Die Ejector System, also known as the Poker Plate, will help speed up die handling through these key features: Adaptable to most die handling & die bonding systems Virtually maintenance free One moving part Stand alone die plating system DESCRIPTIONHigh Speed Die Handling The Model 4750 Poker Plate System solves the problem…
OVERVIEWA specially designed system to allow die to be loosened for quick and safe removal from plastic wafer mounting tape. Eliminate the need for ejector pins or pokers which can break die as they are being ejected from the tack on the tape.DESCRIPTIONA complete system includes a Die Ejector Grid (suitable for die which are…