SEC has a demo room dedicated to providing customers with live equipment demonstrations. Live demos can be tailored to work with the client’s specific components or with dummy parts to prove a process or specific application. Our demo area often has a Model 365 UV Curing System, Wafer Mounters (Models 3100, 3150 or 300), a…
What’s new for most companies right now is the impact that the Corona Virus has had on our industry. As an essential business we have remained open and operating at full capacity throughout the pandemic. We have many of our tape products in stock so your supply is secure. Tapes not in stock can be…
OVERVIEWThe IA-8 is a manually loaded SMIF pod washing system. This system is for cleaning semiconductor device containers and is built with experience advanced knowledge of the latest technology for Semiconductor equipment manufacturing.. It is suitable for pilot lines, research and development. The IA-8 can wash and dry 8 inch SMIF pods and also can…
OVERVIEWCleaning FOUPs and FOSBs is required to improve and maintain the yield of the semiconductor manufacturing process. The IF-12 can wash and dry a variety of FOUPs and FOSBs in one system without changing the set-up because of our unique chamber structure.FEATURES High through-put (compared with our previous system) Small foot print design Protection from…
OVERVIEW The Hugle SC-8 is the solution you need to clean all types of wafer carriers and boxes up to 8” in a single system. The SC-8 is a new generation semi-automatic cassette and box cleaning system. This model features energy efficient, space saving, trouble free design. Special water and air nozzles wash and dry…
OVERVIEWThe SR-EUV/200/150 is Hugle’s fully automatic cleaning system for EUV Reticle PODs, RSP-200 and RSP-150. Cleaning these pods is one of the most demanding applications for container cleaning equipment in the Semiconductor Industry. Hugle has met the challenge with innovative technology and unmatched system reliability. The EUV pod is automatically fed into the system, outer…
OVERVIEW300mm wafers have become the industry standard for semiconductor development and manufacturing. Exceptional FOUP cleaning is required for advanced products especially with the introduction of EUV lithography. Hugle Electronics has built on the solid performance of the UPC-12100 by introducing the UPC-12500. The 12500 is a fully automatic FOUP Cleaning System with excellent performance, throughput…
https://www.semicorp.com/wp-content/uploads/2020/02/Nitto-Msa-840-auto-wafer-mounter.mp4 OVERVIEWSemiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the…
OVERVIEWThe MA2008IIR / MA2008IIP is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.FEATURESCombination of various applications are available: DSC, Coin-stack Non-contact arm, Non-contact table Protection tape peeling / UV irradiation Panel mounting MA2008IIR: for Roll tape MA2008IIP: for Pre-cut tape Easy…
OVERVIEWThe DR8500-III applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″ wafer available 4″ wafer handling function (Option) Low tension applying (RF version) Adding Table/ Roller heating function available Easy operation by Touch panel Follow to CE mark Adding SECS/GEM available