FOUP Cleaner
Semiconductor Equipment Corporation’s SORA UPC-12500 Fully Automatic FOUP Cleaning System has the highest throughput among single FOUP processing systems.
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New In-Process Planarity Option Has Added To The Model 860 Eagle Bonder
Some bonding applications require the ability to adjust the die to substrate planarity during each die bonding cycle. Laser bars and focal plane arrays are two examples. See the new paper in the “Application Notes” section of this site for details.
Tape Peeler Option
Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any 3200 or 3250. Check out the options section of the Model 3200/3250 for more information.
MSA840-II Nitto Denko
Semiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the addition…