Bonding Vcsel’s
EQUIPMENT: MODEL 410 FLIP CHIP DIE BONDER; MODEL 860 OMNI BONDER
Application: Bonding vertical-cavity surface-emitting lasers (VCSELS) using gold/tin preforms
Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder
Solder Flip Chip
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM
Application: Solder Flip Chip
Equipment: Model 850 Flip Chip Placement System
Picking Die From Tape
EQUIPMENT: MODEL 4750 DIE EJECTOR SYSTEM; MODEL 4800 DIE EJECTOR GRID SYSTEM; MODEL 830 PICK & PLACE SYSTEM
Application: Picking die from dicing tape
Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick and Place System
Rework of Underfilled Flip Chips
EQUIPMENT: MODEL 850 FLIP CHIP PLACEMENT SYSTEM WITH MODEL 870 REWORK OPTION
Application: Rework of underfilled flip chips
Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option
Inexpensive In-Process Planarity Adjustment For Die Attach
EQUIPMENT: MODEL 860 EAGLE BONDER
Application: Inexpensive In-process Planarity Adjustment for Die Attach
Equipment: Model 860 Eagle Bonder
Sticky Issues With Semiconductor Processing Tape
by Don Moore, President, Semiconductor Equipment Corporation
Moorpark, CA
Semiconductor International, 1996
Reworking Underfilled Flip Chips
by Don Moore, President, Semiconductor Equipment Corporation
by Gloria Studley, Design Engineer, Semiconductor Equipment Corp.
Moorpark, CA
US Tech, July/August 2000