The Model 865 Die Bonder has distinct advantages above other die bonders in its price category and the specific niche it was designed to be used in. Please compare and see why we rise above as the obvious choice when selecting a bonding tool. Set-up speed: The ability to set-up our bonder faster than…
We are fortunate that as an essential business, we have remained open and operating at full capacity since initial business closures in March. We continue to observing PPE protocols and social distancing protocols (except for this photo).
Changes are coming! We are actively expanding our online store to include the most commonly requested spare parts for our mounters, bonders and rework equipment. New products are added each week. Please register as a user to be linked to your customer account. This will allow the use of purchase orders and optional payment terms.…
SEC has a demo room dedicated to providing customers with live equipment demonstrations. Live demos can be tailored to work with the client’s specific components or with dummy parts to prove a process or specific application. Our demo area often has a Model 365 UV Curing System, Wafer Mounters (Models 3100, 3150 or 300), a…
What’s new for most companies right now is the impact that the Corona Virus has had on our industry. As an essential business we have remained open and operating at full capacity throughout the pandemic. We have many of our tape products in stock so your supply is secure. Tapes not in stock can be…
Introducing the Model 365 UV Curing System for Dicing and Back Grinding Tape SEC will display the new Model 365 UV Curing system this year at Semicon West 2017 in San Francisco. The Model 365 features the same long light source life and simple operation as our popular Model 360. New features include much higher…
Semiconductor Equipment Corporation’s SORA UPC-12500 Fully Automatic FOUP Cleaning System has the highest throughput among single FOUP processing systems.
Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any 3200 or 3250. Check out the options section of the Model 3200/3250 for more information.
Semiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the addition…