Flip Chip Placement System
The Model 850 is a versatile, semi-automatic
placement system for flip chips, chip scale devices
and bare die. The system is intended for low
volume production and development projects
requiring accuracies of +/- 12 microns. A typical
application consists of a cycle in which devices
are picked up from a waffle pack, dipped into
flux and then placed on a substrate.
Other Videos: Model 830, Model HS-1810,
Model 3150, Model 3250, Model 3250-Peeler Option, MSA840-II
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Semiconductor Equipment Corporation | ||
| 5154 Goldman Ave. Moorpark, CA 93021 |
Phone: (805) 529-2293 Fax: (805) 529-2193 sales@semicorp.com |
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