Model 850
Flip Chip Placement System

The Model 850 is a versatile, semi-automatic
placement system for flip chips, chip scale devices
and bare die. The system is intended for low
volume production and development projects
requiring accuracies of +/- 12 microns. A typical
application consists of a cycle in which devices
are picked up from a waffle pack, dipped into
flux and then placed on a substrate.





Other Videos: Model 830, Model HS-1810,
Model 3150, Model 3250, Model 3250-Peeler Option, MSA840-II
Model 850 Product Page>>
   
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021		 Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
  First US Finance Lease and Finance programs available - Contact First US Finance