Model 830
Manual Pick & Place System


The Model 830 Pick and Place system transfers
surface mounted devices from carrier packs
onto pre-epoxied surfaces. It transfers die
or other devices from tape or carrier trays
to any desired packages.










Other Videos:
Model 3150, Model HS-1810, Model 3250
Model 830 Product Page>>
   
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93020
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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