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Model 830 |
| Video Demonstration |
Manual Pick & Place System
The Model 830 Pick and Place system transfers
surface mounted devices from carrier packs
onto pre-epoxied surfaces. It transfers die
or other devices from tape or carrier trays
to any desired packages.
Other Videos: Model 850, Model HS-1810,
Model 3150, Model 3250, Model 3250-Peeler Option, MSA840-II
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Semiconductor Equipment Corporation | ||
| 5154 Goldman Ave. Moorpark, CA 93021 |
Phone: (805) 529-2293 Fax: (805) 529-2193 sales@semicorp.com |
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