| Model 3250 Wafer/Backlap Applicator Semiconductor Equipment Corporation“s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also: eliminates bubbles between tape and wafer, provides uniform tension between tape and wafer, operates with backed and non-backed tape "of edge of wafer. NEW! This model has a Peeler Option Video Other Videos: Model 830, Model 850, Model HS-1810, Model 3150, Model 3250-Peeler Option, MSA840-II |
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