Model 3250
Wafer/Backlap Applicator

Semiconductor Equipment Corporation´s Model
3200 and 3250 apply Protective Tape to Your
Wafer Prior to Backlapping. The applicator also:
eliminates bubbles between tape and wafer,
provides uniform tension between tape and
wafer, operates with backed and non-backed
tape "of edge of wafer.

NEW! This model has a Peeler Option Video





Other Videos: Model 830, Model 850, Model HS-1810,
Model 3150, Model 3250-Peeler Option, MSA840-II
Model 3250 Product Page>>
   
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021		 Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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