Peeler Option

Peeler for removing backgrinding tape once the
wafer has been thinned. This option includes 
a roller assembly, vacuum chuck and tape
dispenser. The peeler can be added to any
3200 or 3250.









Other Videos: Model 830, Model 850, Model HS-1810,
Model 3150, Model 3250-Peeler Option, MSA840-II

Model 3200/3250 Product Page>>
   
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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