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Model 830 Pick and Place System
  Products Overview  

The Model 830 is a general purpose pick and place system for die and surface mount components.  The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages.  A footswitch option controls the pick - up head to lower the pickup tool to working height and return it home.  Open frame design assures full visiblilty and complete access of all system components.  Operator friendly - takes less than two minutes to learn to operate.  Epoxy die bonding capability can be easily added.  The 830 works with any tape - mounted die removal system, including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid pitches. 

 Model 830 Pick and Place System
Product Specifications  
 
  • Plus or minus 25 micron placement accuracy.
  • Four 2" X 2" waffle pack pickup stage available.
  • Four inch square vacuum stage standard (optional sizes available).
  • Consistent bond load.
  • Throughput - up to 400 placements per hour.
  • Dimensions: 26" W X 18" D X 18" H
  • Weight: 35 lbs.
  • Power: 120 VAC 1 amp or 220 VAC 1 amp
  • Vacuum: 20" Hg
  Product Options
  • Die tray pedestal capable of holding up to four 2" X 2" waffle packs.
  • Semiautomatic Z motion.
  • Flat vacuum chuck capable of holding up to four 2" X 2" waffle packs.
  • Stereo zoom microscope and/or projected image cross hair system.
  • High intensity illuminators.
  • Dual position pivoting head for epoxy dispensing.
Contact Sales for more product information.
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93020		 Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com