Semiconductor Equipment Corporation - Model 3200 and 3250 Wafer/Backlap Applicator

Model 3200 & 3250 Wafer/Backlap Applicator

		Product Video
Semiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also: Eliminates bubbles between tape and wafer Provides uniform tension between tape and wafer Operates with backed and non-backed tape Provides adjustable roller pressure Cuts tape within .005 " of edge of wafer
	Model 3200

Up to 6" wafer capability standard.
Trims tape to the edge of the wafer including the flats, within .005".
Manual tape feed.
Manual tape tensioner.
Compatible with standard or interleaved tape.
Vacuum stage wafer hold-down.
Built in cutter tape separation systems.
Captive roller assembly assures consistent wafer/film frame contact pressure.
Adjustable spring loaded platen for optimum contact pressure.
Manual.

		Model 3250
	Four, five, six and eight inch wafer capability standard. Trims tape to the edge of the wafer including the flats, within .005 ". Manual tape feed. Manual tape tensioner. Compatible with standard or interleaved tape. Vacuum stage wafer hold-down. Built in cutter tape separation systems. Captive roller assembly assures consistent wafer/film frame contact pressure. Adjustable spring loaded platen for optimum contact pressure. Manual.

Static Eliminator with power supply.
Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.

Peeler Option:
Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any 3200 or 3250.

Peeler Video


	Spare Blades, End Cut, P/N 19190 Spare Blades, Rotary, Wafer Trimmer


	Weight: 25 lbs. Height: 8" Width: 14" Length: 24" Vacuum: 25" H20

Quickly, Easily and Uniformly Mounts Protective Tape to Wafer for Back Lap Operation

	Step #1 Grasp tape from storage position. Pull over wafer mounting platen.
	Step #2 Affix tape to tensioner frame.
	Step #3 Roll tape with preset tension across wafer for bubble-free application.
	Step #4 Close cutter cover.
	Step #5 Separate tape from roll, using built-in slitter.
	Step #6 Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame.
	Step #7 Remove finished wafer assembly.

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