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| Model 3200 & 3250 Wafer/Backlap Applicator |
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Semiconductor Equipment Corporation´s Model 3200 and 3250 apply Protective Tape to Your Wafer Prior to Backlapping. The applicator also:
- Eliminates bubbles between tape and wafer
- Provides uniform tension between tape and wafer
- Operates with backed and non-backed tape
- Provides adjustable roller pressure
- Cuts tape within .005 " of edge of wafer
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Model 3200 |
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- Up to 6" wafer capability standard.
- Trims tape to the edge of the wafer including the flats, within .005".
- Manual tape feed.
- Manual tape tensioner.
- Compatible with standard or interleaved tape.
- Vacuum stage wafer hold-down.
- Built in cutter tape separation systems.
- Captive roller assembly assures consistent wafer/film frame contact pressure.
- Adjustable spring loaded platen for optimum contact pressure.
- Manual.
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Model 3250 |
- Four, five, six and eight inch wafer capability standard.
- Trims tape to the edge of the wafer including the flats, within .005 ".
- Manual tape feed.
- Manual tape tensioner.
- Compatible with standard or interleaved tape.
- Vacuum stage wafer hold-down.
- Built in cutter tape separation systems.
- Captive roller assembly assures consistent wafer/film frame contact pressure.
- Adjustable spring loaded platen for optimum contact pressure.
- Manual.
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- Static Eliminator with power supply.
- Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
- De-Taper for removing backgrinding tape once the wafer has been thinned; which includes roller assembly carrier, vacuum chuck and tape dispenser.
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- Spare Blades, End Cut, P/N 19190
- Spare Blades, Rotary, Wafer Trimmer
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- Weight: 25 lbs.
- Height: 8"
- Width: 14"
- Length: 24"
- Vacuum: 25" H20
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Quickly, Easily and Uniformly Mounts Protective
Tape to Wafer for Back Lap Operation
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Step #1
Grasp tape from storage position. Pull over wafer mounting platen. |
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Step #2
Affix tape to tensioner frame. |
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Step #3
Roll tape with preset tension across wafer for bubble-free application. |
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Step #4
Close cutter cover. |
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Step #5
Separate tape from roll, using built-in slitter. |
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Step #6
Using built-in fail-safe circular cutter, rotate handle in either direction to trim tape away from tension frame. |
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Step #7
Remove finished wafer assembly. |
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| Contact Sales for more product information. |
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