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Inkjet Cover Tape
  Products Overview Inkjet Cover Tape

Specifically used to apply tape to seal the ink cartridge against ink leakage during storage and transportation.
  Tape Benefits

There is a Semiconductor Equipment Tape that is Perfect for Your Application.
Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is used extensively for Wafer Sawing, Scribing, Expanding. These tapes are available in rolls suitable for all automatic and manual wafer mounting systems where the wafers are being mounted onto tape and film frames.

Tapes are selected for your application based on die size and blade thickness. Small die and hard to cut materials require higher tackiness, while larger die call for lower tackiness. Thicker blades require thicker dicing tape. 

Please contact our Tape Specialist for additional information at (805) 529-2293  or sales@semicorp.com

  Tape Selection
UV Curvable Tape Standard Dicing Tape High Purity Tape Heat Release Tape
UV Curvable
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Standard Dicing
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High Purity
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Heat Release
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Contact Sales for more product information.
Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93021
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
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