Semiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste.
The MSA840-II can be converted to full automatic operation with the addition of a wafer and frame handling tool.
Work holding system
By Vacuuming
Wafer table
Non contact table available
Static eliminator
1 Fan type & 2 brush type equipped
Taping speed control
Variable by manual setting
Taping tension
H/L auto changing with tape diameter
H/L variable by manual setting
Tape remaining
Detecting sensor equipped
Cut number counter
Equipped
No wafer operation (*)
Available
(*) No wafer operation; Tape applying on dicing frame without wafer.
Work holding system
Magnetic holder can be added in case of using high adhesive tape.
Taping speed control
Put number through touch panel.
The number can be embedded in recipe.
Taping tension
Put number through touch panel.
The number can be embedded in recipe.
Cutting miss detection
Available
Cuttind diameter detection
Available
Semi automatic type to set wafer and frame manuallyand to do tape applying, cutting and removing waste tape automatically
Non contact chuck method”to contact 3~4mm wafer edge(Contact chuck method also applicable)
1 Fan type and 2 brush type ionizer equipped
Easy connecting to Fully auto wafer and dicing frame handlingtool for transforming to Fully automatic system.
3.8 inch touch Panel Monitor.
Simple Face, drawing out/in by hand with air cylinder assist.
Applicable wafer size: 4”, 5“, 6”, 8“
Applicable frame size for 6”, for 8”
Through-put: approx. 30 sec/wafer(excluding wafer and frame setting time and wafer mount frame removing time).
Product Video
