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Tape Selection
Tape Mounters
Flip Chip
Die Bonders
Hot Gas Rework
Die Ejector
UV Exposure
The Condor
Pick & Place
Die Expander
Product Index
| Standard Dicing Tape | Request Dicing Tape Sample |
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Semiconductor Wafer Dicing and Hybrid Substrate Sawing Tape There is a Semiconductor Equipment Tape that is perfect for your application. |
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| SEC Dicing Tape Brochure |
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| High Purity Tape | Request Dicing Tape Sample |
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High Purity Pressure Sensitive Expandable Tape with Liner Low ionic impurities and adhesion stability make this the perfect tape for your clean room application. |
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| SEC Dicing Product Line |
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| UV Curvable Tape | Request Dicing Tape Sample |
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UV Tape A very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. |
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| SEC Dicing Product Line |
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| Model 300 |
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Wafer/Frame Tape Applicator Specifically designed for 300mm wafers. |
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| SEC Model 300 Brochure |
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| Model 3100 & Model 3150 |
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Wafer/Frame Tape Applicators Model 3100 & Model 3150 Wafer/Film Tape Applicators apply tape with optimal control of temperature and pressure parameters. |
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| SEC Model 3100-3150 Brochure |
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| Model 3200 & Model 3250 |
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Wafer/Backlap Applicators Applies protective tape to your wafer prior to backlapping. |
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| SEC Model 3200 Brochure |
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| Model 850 |
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Flip Chip Placement System A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. |
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| SEC Model 850 Brochure |
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| Model 860 |
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The Eagle Omni Bonder A multi-use system which can be configured for bonding laser diodes, flip chip and eutectic bonded die. |
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| SEC Model 860 Brochure |
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| Model 430 |
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Hot Gas Rework Module Hot Gas jet directs up to 800 degrees celsius heated gas through an interchangeable quartz nozzle to a specific area. |
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| SEC Model 430 Brochure |
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| Model 450 |
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Hot Gas Rework Station Hot Gas Rework Station removes surface mounted components and bonded die. |
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| SEC Model 450 Brochure |
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| Model 4750 |
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Die Ejector System (Poker Plate) Speed up die handling. |
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| SEC Model 4750 Brochure |
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| Model 4800 |
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Die Ejector Grid Die Ejector Grid System for loosening die for quick, safe removal from wafer mounting tape. |
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| SEC Model 4800 Brochure |
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| Model 360 |
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UV Exposure System Revolutionary new design cures UV tapes quickly and uniforly, has an ultra long light source, and handles all size wafers to 300mm. |
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| SEC Model 360 Brochure |
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| The Condor |
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The Condor Multifunctional Bond tester. Pull and shear test unit designed for you application. |
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| Xyztec Condor Brochure |
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| Model 830 |
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Manual Pick & Place System Pick and Place surface mounted devices from carrier packs onto pre-epoxied surfaces. Transfers die or other devices from tape. |
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| SEC Model 830 Brochure |
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| Model HS-1810 |
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Die Matrix Expander Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control. |
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| SEC Model 1810 Brochure |
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| Aquabond |
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Aquabond Adhesive A family of unique, water soluble adhesives to mount items that require extra firm mounting. |
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| SEC Aquabond Brochure |
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Semiconductor Equipment Corporation | ||
| 5154 Goldman Ave. Moorpark, CA 93020 |
Phone: (805) 529-2293 Fax: (805) 529-2193 sales@semicorp.com |
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Leasing Programs available by Lease One Corp. - Contact Richard Folsom |