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	Die Matrix Expander - New Product
	Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100 degrees C and built in cutter tape separation system. Learn More>>

	Press Releases
	November 2004	Contract to Distribute Yamaha iCUBE II
	February 2005	Brochure Announcement
	March 2005	New Product Announcement
	June 2005	Model 3250 Back Lap Tape Remover
	July 2005	SEC Upgrades the Model 860
	July 2006	SEC Introduces Revalpha: New Thermal Release Tape
	July 2006	SEC Introduces a New Motorized Take-up System Option
	January 2007	SEC Upgrades Model 860 Bonder

	Trade Show Schedule
	SEMICON China 2008 Shanghai, China March 18-20 New Shanghai International Expo Centre Semiconductor Equipment Corp. Booth #TBD