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	FOUP Cleaner - New Product
	Semiconductor Equipment Corporation's SORA UPC-12500 Fully Automatic FOUP Cleaning System has the highest throughput among single FOUP processing systems.
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	MSA840-II Nitto Denko - New Product	Product Video
	Semiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the addition of a wafer and frame handling tool.
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	New In-process Planarity Option has added to the Model 860 Eagle Bonder
	Some bonding applications require the ability to adjust the die to substrate planarity during each die bonding cycle. Laser bars and focal plane arrays are two examples. See the new paper in the “Application Notes” section of this site for details.
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	Tape Peeler Option - New Product	Product Video
	Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape dispenser. The peeler can be added to any 3200 or 3250. Check out the options section of the Model 3200/3250 for more information.
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	Die Matrix Expander - New Product
	Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100 degrees C and built in cutter tape separation system.
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	Press Releases
	November 2004	Contract to Distribute Yamaha iCUBE II
	February 2005	Brochure Announcement
	March 2005	New Product Announcement
	June 2005	Model 3250 Back Lap Tape Remover
	July 2005	SEC Upgrades the Model 860
	July 2006	SEC Introduces Revalpha: New Thermal Release Tape
	July 2006	SEC Introduces a New Motorized Take-up System Option
	January 2007	SEC Upgrades Model 860 Bonder

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