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New Products

  Die Matrix Expander - New Product Model 1810 Die Matrix Expander
 
Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100 degrees C and built in cutter tape separation system.

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  Press Releases

 
  November 2004 Contract to Distribute Yamaha iCUBE II
  February 2005 Brochure Announcement
  March 2005 New Product Announcement
  June 2005 Model 3250 Back Lap Tape Remover
  July 2005 SEC Upgrades the Model 860
  July 2006 SEC Introduces Revalpha: New Thermal Release Tape
  July 2006 SEC Introduces a New Motorized Take-up System Option
  January 2007 SEC Upgrades Model 860 Bonder
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  Trade Show Schedule

 
  SEMICON China 2008
Shanghai, China
March 18-20
New Shanghai International Expo Centre

Semiconductor Equipment Corp. Booth #TBD



Semiconductor icons   Semiconductor Equipment Corporation
5154 Goldman Ave.
Moorpark, CA 93020
Phone: (805) 529-2293
Fax: (805) 529-2193
sales@semicorp.com
  LeaseOne - logo Leasing Programs available by Lease One Corp. - Contact Richard Folsom