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"SEC contains Application Notes for |
Quicklinks
Application Notes
| Application Index |
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| Rework of Underfilled Flip Chips Equipment: Model 850 Flip Chip Placement System with Model 870 Rework Option |
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| Hot Gas Rework Equipment: Model 4450 Hot Gas Rework Station |
Read Notes>> | |
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| Picking Die From Tape Equipment: Model 4750 Die Ejector System; Model 4800 Die Ejector Grid System; Model 830 Pick & Place System |
Read Notes>> | |
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| Solder Flip Chip Equipment: Model 850 Flip Chip Placement System |
Read Notes>> | |
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| Bonding VCSEL's Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder |
Read Notes>> | |
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| Wafer Mounting for Dicing Equipment: Model 300, 3100 and 3150 Wafer Film Frame Tape Applicators |
Read Notes>> | |
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| Bonding Edge Emitting Laser Diodes Equipment: Model 410 Flip Chip Die Bonder; Model 860 Omni Bonder |
Read Notes>> | |
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| Thermosonic Bonding Gold Bumped Die Equipment: Model 410 Flip Chip Aligner/Bonder; Model 410XP Precision Bonder; Model 860 Omni Bonder |
Read Notes>> | |
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Semiconductor Equipment Corporation | ||
| 5154 Goldman Ave. Moorpark, CA 93020 |
Phone: (805) 529-2293 Fax: (805) 529-2193 sales@semicorp.com |
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